Sealevel IBR-i3-3217UE i3 COM Express Module
Price on request
- COM Express Basic with Type 6 connector layout
- Includes 1.6GHz Intel Core i3-3217UE dual-core processor
- Extended temperature operation from -40°C to 85°C ambient
- Supports Microsoft Windows and Linux operating systems
Sealevel IBR-i3-3217UE i3 COM Express Module
The Sealevel IBR-i3-3217UE COM Express Type 6 module features an Intel Core i3-3217UE dual-core 1.6GHz processor and supports up to 16GB of 1600MHz DDR3 RAM. The module offers low power consumption (TDP 8W) and can operate fanless over an extended operating temperature range of -40°C to 85°C ambient, while the 2.3mm thick PCB is ideal for high vibration environments. Standard features include integrated Gigabit Ethernet controller, up to seven PCI Express X1 lanes, one PCI Express X16, two SATA III (6Gb/s) interfaces, two SATA II (3Gb/s) interfaces, eight USB 2.0 ports, four USB 3.0 ports, LPC bus, SMBus and I2C bus. The module includes three Digital Display Interfaces (DDI) for DisplayPort, HDMI or DVI displays.
Sealevel specializes in COM Express carrier boards built to your specific application requirements. Our extensive library of proven I/O circuits including serial, analog, and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application. COM Express development boards are also available to allow software development to begin immediately while the custom carrier board is designed.
Features
- COM Express Basic with Type 6 connector layout
- Includes 1.6GHz Intel Core i3-3217UE dual-core processor
- Maximum 16GB DDR3 1600MHz RAM via dual 204-pin SODIMM slots
- Integrated Mobile Intel QM77 Express chipset
- Integrated Gigabit Ethernet controller
- I/O interfaces can include up to 7x PCI Express X1, PCI Express X16, 2x SATA III (6Gb/s), 2x SATA II (3Gb/s), 8x USB 2.0, 4x USB 3.0, LPC bus, SMBus and I2C bus
- Digital high definition audio integrated into Mobile Intel QM77 chipset with codec support on carrier board
- Intel HD Graphics 4000 integrated on processor, operating at 650-1300MHz, supporting DirectX 11, OpenGL 3.1 and OCL 1.1
- Three Digital Display Interfaces (DDI) supporting DisplayPort, HDMI, and DVI displays
- Analog VGA supported with 300MHz DAC with resolutions up to QXGA (2048×1536)
- Integrated watchdog timer and hardware monitors for supply voltages and CPU temperature
- Embedded BIOS features AMI Aptio EFI with 16MB SPI flash
- Supports ACPI 3.0 power management with Smart Battery Support (LTC4100 and LTC1760)
- Supports Microsoft Windows and Linux operating systems
- Extended temperature operation from -40°C to 85°C ambient
Specifications
| BIOS | AMI Aptio EFI with CMOS Backup in 16MB SPI Flash |
|---|---|
| Chipset | Intel QM77 Express |
| CPU Type | Intel Core i3 |
| CPU | 1.6GHz Intel Core i3-3217UE Dual-Core |
| Dimensions | 4.92″ (L) x 3.74″ (W) |
| Humidity Range | 10 – 90% Relative Humidity, Non-Condensing |
| Max RAM | 16GB ECC DDR3 1333/1600 MHz via Two 204-pin SODIMM Slots |
| Max Video | QXGA 2048×1536 @ 60Hz |
| Operating Temperature | -40°C to 85°C (-40°F to 185°F) |
| Power Requirement | TDP 8W |
| Storage Temperature | -55°C to 85°C (-67°F to 185°F) |
For more information: Sealevel
Sealevel IBR-i3-3217UE i3 COM Express Module
Additional information
| Producent | Sealevel |
|---|---|
| Produktkategori | Computer on Module |
