Laser Systems

CLC’s laser micromachining technology rooted in the world 1st wafer laser processing system in 1972. Since then, we’ve continued to evolve this technology in collaboration with our customers.

Major users are the failure analysis labs in the semiconductor industry, intelligent automotive industry, and forensic labs in law enforcement departments.

It adapts to the widest range of epoxy mold compound and various types of fillers, keeping gold, silver, brass, or aluminum bonding wire, the silicon, GaAs, InP die undamaged.

If you’re not sure if your material will work, send it in for a free material testing study by our application experts.

Free Material Testing Study: Free Study

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